High-Precision SMT Assembly for Complex PCBs
From 01005 Passives to Large BGAs.
Trusted by European & North American OEMs for 15+ years.
Technical
Capabilities
Whether you need a quick prototype run or a stable low / large volume production batch.
- Lead-Free / RoHS Compliant
- IATF16949 Automotive Certification
- IPC-A-610 Class 2 & 3
| Parameter | Specification |
|---|---|
| Component Size | 01005 & 0201 Packages BGA, QFN, LGA, DFN Leadless Packages 0.3mm Fine Pitch Connectors |
| Placement Accuracy | ±0.035mm (Chips), ±0.025mm (QFP) |
| PCB Types | Rigid, Flex, Rigid-Flex, Aluminum (Metal Core) |
| Quality Control | 100% 3D SPI (Solder Paste Inspection) & Online AOI & X-Ray |
| Monthly Capacity | 52 million placements |
SMT Manufacturing Process
From nano-coated stencils to 10-zone nitrogen reflow, every step is data-driven.
Solder Paste Printing
Precision Solder Paste Printers with Nano-coated Stencils. Ensuring perfect release for 0.3mm pitch pads.
3D SPI
Detects volume & height deviations. Stops 95% of potential defects before components pick & place.
High-Speed Mounting
Handling complex BOMs from 01005 passives to large BGA/Connectors.
Reflow Soldering
Oxygen-free soldering environment (< 1000 PPM). Our N2 process enhances wetting, prevents oxidation, and delivers IPC Class 3 compliant solder joints.
We Don't Guess. We Verify.
Online AOI
Detects missing components & polarity immediately after reflow.
X-Ray Inspection
For BGA & QFN. We verify voiding < 25% (IPC Class 3) and check for bridges.
First Article Inspection (FAI)
Automated LCR measurement against BOM. Mass production starts only after 100% Pass.
IPQC Patrol
Regular line monitoring for ESD compliance, soldering temp, and operator standards.
Trusted by Industrial
Automation Leaders.
We specialize in mission-critical electronics where failure is not an option. Our process controls are rigorous enough for automotive and medical standards.
Defect Rate
On this 12-Layer project
Components
High density placement
SMT Assembly FAQs
Q
What is the smallest component size you can assemble?
What is the smallest component size you can assemble?
We handle 01005 (0.4mm × 0.2mm) chip components routinely, with placement accuracy of ±0.035mm. For high-volume production, we recommend 0201 or larger for better yields and lower costs. 01005 requires specialized stencil design and nitrogen reflow profiles.
Q
How do you ensure BGA soldering quality?
How do you ensure BGA soldering quality?
We use 3D X-Ray inspection to detect voids, bridges, and missing balls. Our process guarantees voiding <25% (IPC Class 3 standard). For 0.4mm pitch BGAs, we use microsection analysis and optimize stencil apertures to achieve 100% wetting.
Q
Do you support lead-free and RoHS compliance?
Do you support lead-free and RoHS compliance?
Yes. Our standard process uses SAC305 lead-free solder (Sn96.5/Ag3.0/Cu0.5) and all materials are RoHS 3 compliant. We provide Certificates of Compliance and material declarations for medical and automotive customers requiring full traceability.
Q
What is the typical lead time for prototypes vs. production?
What is the typical lead time for prototypes vs. production?
Prototypes: 3-5 days for 5-50 pieces (expedite available for 48h). Production: 2-3 weeks for 1,000+ units depending on component availability. We offer consignment options if you supply critical/long-lead components to shorten TAT.
Q
What files do you need for a quote?
What files do you need for a quote?
We need Gerber files (RS-274X), BOM (Excel/CSV) with manufacturer part numbers, and Pick-and-Place/Centroid data. For complex boards, assembly drawings help clarify polarity and orientation. We accept Altium, Eagle, and KiCad native files for DFM review.
Q
What inspection methods do you use during SMT?
What inspection methods do you use during SMT?
We implement 3D SPI (Solder Paste Inspection) after printing, Online AOI after placement, and X-Ray for hidden joints (BGAs/QFNs). First Article Inspection (FAI) is mandatory for all new products before mass production ramp-up.
Other Services Available At ACE Electronics
From PCB fabrication to fully assembled products. Streamline your supply chain with our integrated manufacturing services.
Component Sourcing
Global sourcing of active and passive components, connectors, and modules. Procurement with traceability, counterfeit avoidance, and long-term availability planning.
Explore Component SourcingParylene Coating
In-house CVD parylene coating for ultimate moisture and chemical protection. Ideal for medical devices and harsh environments.
Learn About Parylene CoatingBox Build Assembly
Complete electromechanical integration: enclosures, cable harnesses, PCB mounting, and functional testing to finished product.
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